Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer

ABSTRACT

An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.

This application is a divisional of application Ser. No. 10/254,982,filed Sep. 26, 2002, upon which this application claims the benefitsprovided in 35 USC § 120.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Applications No. 2001-298509, filed Sep. 27,2001; and No. 2002-271536, filed Sep. 18, 2002, the entire contents ofboth of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to the technique for manufacturing semiconductordevices, and more particularly to a mechanism for and a method ofpeeling adhesive tape bonded to segmented semiconductor wafers, anapparatus for and a method of peeling adhesive tape bonded to segmentedsemiconductor wafers, a pickup apparatus and a pickup method whichinclude a mechanism for peeling adhesive tape bonded to segmentedsemiconductor wafers and pick up each semiconductor chip, asemiconductor device manufacturing apparatus and a semiconductor devicemanufacturing method which include the peeling mechanism, the peelingdevice, or the pickup apparatus.

2. Description of the Related Art

Generally, in the processes of manufacturing semiconductor devices, asemiconductor wafer on which elements have been formed is divided intosegments along dicing lines or chip division lines, thereby forming aplurality of semiconductor chips. FIGS. 1A and 1B show a state of asegmented semiconductor wafer (or semiconductor chip) 100, which isbonded to adhesive tape 101 a. FIG. 1A is a perspective view of thewafer 100. FIG. 1B is a sectional view of the wafer 100 taken along line1B-1B of FIG. 1A. Each semiconductor chip 100 is picked up from theadhesive tape 101 a and undergoes the mounting processes, including theprocess of mounting the chip on a leadframe or TAB tape and the processof sealing the chip into a package, which completes a semiconductordevice.

When each semiconductor chip 100 is picked up, the reverse of thesemiconductor wafer adhering side of the adhesive tape 101 a is bondedto another adhesive tape 101 b adhered to a wafer ring. Then, theadhesive tape 101 a is peeled and the wafer ring is installed on apickup apparatus, which picks up each semiconductor chip 100.

FIG. 2 is an enlarged sectional view of the main part of the mechanismfor picking up semiconductor chips 100 from the adhesive tape 101 b in aconventional pickup apparatus. When semiconductor chips 100 are peeledfrom the adhesive tape 101 b bonded to the wafer ring and picked up,thrust pins (or pick-up needles) 102 are pushed up (or raised) via theadhesive tape 101 b from the backside of the semiconductor chip 100,thereby peeling the semiconductor chip 100 with the help of the elasticforce of the adhesive tape 101 b. The base of each thrust pin 102 isprovided on a pin holder 103 in such a manner that it is located in aposition corresponding to each corner or the central part of thesemiconductor chip 100.

The procedure for peeling the semiconductor chips 100 from the adhesivetape 101 b is as follows. First, a holding table on which the adhesivetape 101 b to which the semiconductor chips 100 are bonded is fixed ismoved in such a manner that a semiconductor chip 100 to be picked up ispositioned above the thrust pins 102. Next, the position of thesemiconductor to be peeled is sensed and a mark for determining whetherthe chip is good or bad is sensed. Then, a vacuum is drawn from theinside of a backup holder 104, thereby causing the adhesive tape 101 bto adhere to the top surface of the backup holder 104 by suction and befixed. In this state, the pin holder 103 on which the thrust pins 102are provided is raised, thereby causing the thrust pins 102 to stick outof the top surface of the backup holder 104, with the result that thethrust pins push up the semiconductor chip 100 from the backside via theadhesive tape 101 b.

In recent years, to incorporate semiconductor chips into, for example, acard-like thin package, there have been strong demands toward makingsemiconductor chips thinner. The backside of a semiconductor wafer ispolished, grounded, and etched to a thickness of 100 μm or less.However, when a semiconductor chip is made as thin as 100 μm or less,the chip cracks, or cracks occur, at the time of bonding the chip toanother adhesive tape, which decreases the manufacturing yield. That is,after the semiconductor chips 100 bonded to the adhesive tape 101 a arebonded to another adhesive tape 101 b bonded to the wafer ring, crackstake place in the semiconductor chips at the time of peeling theadhesive tape 101 a. When the semiconductor chips are bonded to anotheradhesive tape, there arises another problem: the semiconductor chips 100touch each other, permitting them to chip, which degrades the quality ofthe semiconductor devices.

When each semiconductor chip is picked up, cracks or chipping alsooccurs. The crack problem arising at the time of picking up eachsemiconductor chip with a thickness of 100 μm or less will be explainedin further detail by reference to FIGS. 3A, 3B, 4A and 4B. In the casewhere a semiconductor chip is very thin as described above, even whenthe periphery of the semiconductor chip 100 (particularly its corners)has come off, the semiconductor chip 100 warps concavely before peelingas shown in FIG. 3A because the speed at which the adhesive tape 101 bpeels is slower than the speed at which the thrust pins 102 go up, withthe result that cracks take place as shown in FIG. 3B. Alternatively, asshown in FIGS. 4A and 4B, when the backside of a semiconductor chip 100is pushed up by the thrust pins 102, with the adhesive tape 101 bintervening between them, cracks occur in the part where thesemiconductor chip 100 and the thrust pins 102 are in contact with eachother in a state where only the corners are peeled, or the thrust pins102 penetrate, with the result that the chip cracks. When the thicknessof the semiconductor chip is 100 μm or more, such a phenomenon is lessliable to take place because the strength (in the direction ofthickness) of the semiconductor chip is great on account of the adhesionof the adhesive tape 101 b to the semiconductor chip 100.

As described above, when a semiconductor chip is made thinner, theresistance of the semiconductor chip to breaking decreases, with theresult that a decrease in the quality due to cracks or chipping and adrop in the yield cannot be avoided by a conventional mechanism for andmethod of peeling adhesive tape and by a conventional apparatus for andmethod of picking up semiconductor chips. Therefore, there have beendemands for improvements in not only that mechanism, apparatus, andmethod but also an apparatus for and a method of manufacturingsemiconductor devices which include the mechanism, apparatus, andmethod.

BRIEF SUMMARY OF THE INVENTION

According to an aspect of the present invention, there is provided anadhesive tape peeling mechanism comprising: an adhering section whichadheres by suction to a segmented semiconductor wafer bonded to adhesivetape; and a porous member which is provided on the surface adhering tothe segmented semiconductor wafer of the adhering section and is dividedinto at least two adhering areas in the direction in which adhesive tapeis peeled and which adheres to the segmented semiconductor wafer bysuction and fixes the segmented semiconductor wafer in place.

According to another aspect of the present invention, there is provideda apparatus for peeling adhesive tape bonded to a segmentedsemiconductor wafer, comprising: a holding table which includes a waferadhering section having a porous member divided into at least twoadhering areas in the direction in which adhesive tape is peeled andwhich adheres by suction to the segmented semiconductor wafer bonded toadhesive tape and fixes the segmented semiconductor wafer in place; apeeling claw which pulls one end of the adhesive tape and peels thetape; a first suction device which adheres to the segmentedsemiconductor wafer by suction through a first suction path provided soas to correspond to each adhering area of the wafer adhering section; asecond suction device which adheres to the segmented semiconductor waferby suction through a second suction path provided so as to correspond toeach adhering area of the wafer adhering section; and a switching unitwhich switches between the suction of the segmented semiconductor waferby the first suction device and the suction of the segmentedsemiconductor wafer by the second suction device on a suction pathbasis, wherein one end of the adhesive tape is pulled and peeled withthe peeling claw, while the first suction device is adhering to thesegmented semiconductor wafer by suction through the first suction path,the switching unit changes the switching paths when a part of theadhesive tape near the adjacent adhering areas of the wafer adheringsection is peeled, and the second suction path of the second suctiondevice corresponding to the adhering area adheres the segmentedsemiconductor wafer by suction.

According to still another aspect of the present invention, there isprovided a pickup apparatus which has a peeling mechanism for peelingadhesive tape bonded to a segmented semiconductor wafer and picks upeach semiconductor chip, the pickup apparatus comprising: a holdingtable which includes a wafer adhering section having a porous memberdivided into at least two adhering areas in the direction in whichadhesive tape is peeled and which adheres by suction to the segmentedsemiconductor wafer bonded to adhesive tape and fixes the segmentedsemiconductor wafer in place; a peeling claw which pulls one end of theadhesive tape and peels the adhesive tape; a first suction device whichadheres to the segmented semiconductor wafer by suction through a firstsuction path provided so as to correspond to each adhering area of thewafer adhering section; a second suction device which adheres to thesegmented semiconductor wafer by suction through a second suction pathprovided so as to correspond to each adhering area of the wafer adheringsection; a switching unit which switches between the suction of thesemiconductor wafer by the first suction device and the suction of thesegmented semiconductor wafer by the second suction device on a suctionpath basis, and a suction collet which adheres to each semiconductorchip by suction and picks up the semiconductor chip, wherein one end ofthe adhesive tape is pulled and peeled with the peeling claw, while thefirst suction device is adhering to the segmented semiconductor wafer bysuction through the first suction path, the switching unit changes theswitching paths when a part of the adhesive tape near the adjacentadhering areas of the wafer adhering section is peeled, the secondsuction path corresponding to the adhering area of the second suctiondevice adheres to the segmented semiconductor wafer by suction, and thesuction collet adheres to each semiconductor chip by suction and picksup the semiconductor chip after the peeling of the adhesive tape iscompleted.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1A is a perspective view showing a state of a segmentedsemiconductor wafer (or semiconductor chip) to help explain theprocesses of manufacturing conventional semiconductor devices;

FIG. 1B is a sectional view taken along line 1B-1B of FIG. 1, showing astate of a segmented semiconductor wafer (or semiconductor chip) to helpexplain the processes of manufacturing conventional semiconductordevices;

FIG. 2 is an enlarged sectional view of the main part of the mechanismfor picking up a semiconductor chip from adhesive tape in a conventionalpickup apparatus;

FIG. 3A is a sectional view to help explain cracks occurring when thethickness of a semiconductor chip is 100 μm or less;

FIG. 3B is a plan view which shows a state where a semiconductor chippeels and which helps explain cracks occurring when the thickness of thesemiconductor chip is 100 μm or less;

FIG. 4A is a sectional view to help explain cracks occurring due toanother cause when the thickness of a semiconductor chip is 100 μm orless;

FIG. 4B is a plan view which shows a state where a semiconductor chippeels and which helps explain cracks occurring due to another cause whenthe thickness of the semiconductor chip is 100 μm or less;

FIG. 5 is a perspective view showing a schematic configuration of a diebonder according to a first embodiment of the present invention;

FIG. 6A is a top view to help explain the configuration of a waferadhering section used in a peeling mechanism and a pickup mechanism;

FIG. 6B is a sectional view which is taken along line 6B-6B of FIG. 6Aand which helps explain the configuration of the wafer adhering sectionused in the peeling mechanism and pickup mechanism;

FIG. 7A is a top view of the wafer adhering section to help explain thewafer adhering section and the arrangement of segmented semiconductorwafers;

FIG. 7B is a plan view which shows an example of the arrangement ofsegmented semiconductor wafers and which helps explain the waferadhering section and the arrangement of segmented semiconductor wafers;

FIG. 7C is a plan view which shows another example of the arrangement ofsegmented semiconductor wafers and which helps explain the waferadhering section and the arrangement of segmented semiconductor wafers;

FIG. 8 is a sectional view to help explain the mechanism for peelingadhesive tape in a die bonder;

FIG. 9A is a sectional view to help explain an example of theconfiguration of an auxiliary plate;

FIG. 9B is a sectional view to help explain another example of theconfiguration of the auxiliary plate;

FIG. 10 is a sectional view to help explain the pickup mechanism forsemiconductor chips in the die bonder;

FIG. 11 is a sectional view to help explain another example of theconfiguration of the pickup mechanism for semiconductor chips in the diebonder;

FIG. 12A is a perspective view which shows the process of peelingadhesive tape and which helps explain the process of mounting picked-upsemiconductor chips;

FIG. 12B is a perspective view which shows a pickup process and whichhelps explain the process of mounting picked-up semiconductor chips;

FIG. 12C is a perspective view which shows a mounting process and whichhelps explain the process of mounting picked-up semiconductor chips;

FIG. 13 is a flowchart for a die bonding process in the die bonder;

FIG. 14A is a perspective view to help explain a picker and an adhesivetape peeling process;

FIG. 14B is a perspective view to help explain the picker and a pickupprocess;

FIG. 14C is a perspective view to help explain the picker and a traypackaging process;

FIG. 15A is a perspective view to help explain a flip chip bonder and anadhesive tape peeling process;

FIG. 15B is a perspective view to help explain the flip chip bonder anda pickup process;

FIG. 15C is a perspective view to help explain the flip chip bonder anda flip chip connecting process;

FIG. 16A is a perspective view to help explain a film adhesive bonderand an adhesive tape peeling process;

FIG. 16B is a perspective view to help explain the film adhesive bonderand a pickup process;

FIG. 16C is a perspective view to help explain the film adhesive bonderand a mounting process;

FIG. 17A is a perspective view to help explain an inner lead bonder andan adhesive tape peeling process;

FIG. 17B is a perspective view to help explain the inner lead bonder anda pickup process;

FIG. 17C is a perspective view to help explain the inner lead bonder anda mounting process;

FIG. 18 is a sectional view which helps explain a second embodiment ofthe present invention and which shows a configuration of a waferadhering section and its vicinity used in a peeling mechanism;

FIG. 19A is a perspective view showing a state of a semiconductor waferthat has been just ground which helps explain a third embodiment of thepresent invention;

FIG. 19B is a sectional view taken along line 19B-19B in FIG. 19A;

FIG. 20A is a perspective view showing an early process of peeling anadhesive tape which helps explain a third embodiment of the presentinvention;

FIG. 20B is a sectional view taken along line 20B-20B in FIG. 20A;

FIG. 21A is a perspective view showing the middle of peeling theadhesive tape which helps explain a third embodiment of the presentinvention;

FIG. 21B is a sectional view taken along line 21B-21B in FIG. 21A;

FIG. 22A is a perspective view showing the step of picked-upsemiconductor chips which helps explain the third embodiment of thepresent invention;

FIG. 22B is a sectional view taken along line 22B-22B in FIG. 22A;

FIGS. 23A and 23B are enlarged sectional views circumferential part ofplace in the semiconductor chips at the time of peeling the adhesivetape;

FIG. 24 is a sectional view which helps explain a fourth embodiment ofthe present invention and which shows a schematic configuration;

FIG. 25A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 25B is a sectional view which is taken along line 25B-25B of FIG.25A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 26A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 26B is a sectional view which is taken along line 26B-26B of FIG.26A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 27A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 27B is a sectional view which is taken along line 27B-27B of FIG.27A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 28A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 28B is a sectional view which is taken along line 28B-28B of FIG.28A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 29A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 29B is a sectional view which is taken along line 29B-29B of FIG.29A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 30A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 30B is a sectional view which is taken along line 30B-30B of FIG.30A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 31A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 31B is a sectional view which is taken along line 31B-31B of FIG.31A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 32A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 32B is a sectional view which is taken along line 32B-32B of FIG.32A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 33A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 33B is a sectional view which is taken along line 33B-33B of FIG.33A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 34A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 34B is a sectional view which is taken along line 34B-34B of FIG.34A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 35A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 35B is a sectional view which is taken along line 35B-35B of FIG.35A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 36A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 36B is a sectional view which is taken along line 36B-36B of FIG.36A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 37A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 37B is a sectional view which is taken along line 37B-37B of FIG.37A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 38A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 38B is a sectional view which is taken along line 38B-38B of FIG.38A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 39A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 39B is a sectional view which is taken along line 39B-39B of FIG.39A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 40A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 40B is a sectional view which is taken along line 40B-40B of FIG.40A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 41A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 41B is a sectional view which is taken along line 41B-41B of FIG.41A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 42A is a top view showing still another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 42B is a sectional view which is taken along line 42B-42B of FIG.42A and which shows still another configuration of the wafer adheringsection applied to the first to fourth embodiments;

FIG. 43A is a top view showing another configuration of the waferadhering section applied to the first to fourth embodiments;

FIG. 43B is a sectional view which is taken along line 43B-43B of FIG.43A and which shows another configuration of the wafer adhering sectionapplied to the first to fourth embodiments;

FIG. 44A is a sectional view of porous adhesive tape to help explainanother configuration of the wafer adhering section applied to the firstto fourth embodiments;

FIG. 44B is a sectional view of a support member to help explain anotherconfiguration of the wafer adhering section applied to the first tofourth embodiments;

FIG. 45 is a sectional view which shows a state where the support memberis stuck to porous adhesive tape and which helps to explain anotherconfiguration of the wafer adhering section applied to the first tofourth embodiments;

FIGS. 46A to 46C are sectional views to help explain the process ofpeeling the adhesive tape when the porous adhesive tapes shown in FIGS.44A, 44B and 45 are used;

FIGS. 47A to 47C are sectional views to help explain a pickup processwhen the porous adhesive tapes shown in FIGS. 44A, 44B and 45 are used;

FIGS. 48A and 48B are sectional views to help explain the process ofremoving defective semiconductor chips to reuse the porous adhesivetape;

FIG. 49A is a plan view to help explain a more concrete configuration ofthe support member;

FIG. 49B is a sectional view taken along line 49B-49B of FIG. 49A tohelp explain the more concrete configuration of the support member;

FIG. 50A is a plan view to help explain another more concreteconfiguration of the support member;

FIG. 50B is a sectional view taken along line 50B-50B of FIG. 50A tohelp explain the one other more concrete configuration of the supportmember;

FIG. 51A is a plan view to help explain another more concreteconfiguration of the support member;

FIG. 51B is a sectional view taken along line 51B-51B of FIG. 51A tohelp explain the one other more concrete configuration of the supportmember;

FIG. 52A is a plan view to help explain still another more concreteconfiguration of the support member;

FIG. 52B is a sectional view taken along line 52B-52B of FIG. 52A tohelp explain the one other more concrete configuration of the supportmember;

FIG. 53A is a plan view to help explain another more concreteconfiguration of the support member;

FIG. 53B is a sectional view taken along line 53B-53B of FIG. 53A tohelp explain the one other more concrete configuration of the supportmember;

FIG. 54A is a plan view to help explain still another more concreteconfiguration of the support member;

FIG. 54B is a sectional view taken along line 54B-54B of FIG. 54A tohelp explain the one other more concrete configuration of the supportmember; and

FIGS. 55A and 55B are sectional views to help explain another example ofthe adhesive tape.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 5, 6A, 6B, 7A to 7C, 8, 9A, 9B, 10, 11, 12A to 12C and 13 helpexplain an adhesive tape peeling mechanism, an adhesive tape peelingapparatus, an adhesive tape peeling method, a semiconductor chip pickupapparatus, a semiconductor chip pickup method, a semiconductor devicemanufacturing method, and a semiconductor device manufacturing apparatuswhich are related to a first embodiment of the present invention. Inthese figures, a die bonder is taken as an example. FIG. 5 is aperspective view showing a schematic configuration of the die bonder.FIGS. 6A and 6B are a plan view and a sectional view, respectively, tohelp explain the configuration of a wafer adhering section used in thepeeling mechanism and pickup mechanism. FIGS. 7A to 7C are plan views tohelp explain the wafer adhering section and the arrangement of segmentedsemiconductor wafers. FIG. 8 is a sectional view to help explain anadhesive tape peeling mechanism in the die bonder. FIGS. 9A and 9B aresectional views to help explain an example of the configuration of anauxiliary plate used in peeling adhesive tape by use of the peelingmechanism of FIG. 8. FIGS. 10 and 11 are sectional views to help explainthe semiconductor chip pickup mechanism in the die bonder. FIGS. 12A to12C are schematic diagrams to help explain the process of mountingpicked-up semiconductor chips. FIG. 13 is a flowchart for the diebonding process at the die bonder.

The die bonder shown in FIG. 5 comprises a peeling mechanism for peelingadhesive tape, a pickup mechanism for picking up semiconductor chips, atransfer mechanism for transferring the picked-up semiconductor chipsonto a leadframe, and a conveyer mechanism for conveying the leadframe.

The peeling mechanism includes a holding table 3, a video camera 4, apeeling claw 21, an auxiliary plate 22, and a suction unit 20. Thepickup mechanism is composed of the holding table 3, the video camera 4,the suction collet 10, and the suction unit 20. The video camera 4 andthe suction unit 20 are shared by the peeling mechanism and the pickupmechanism.

The holding table 3 has a wafer adhering section 2 composed of a porousmember, such as a film-like ceramic member/glass epoxy board, divided(or partitioned) into at least two adhering areas in the direction inwhich adhesive tape is peeled. In the embodiment, the wafer adheringsection 2 has seven adhering areas 2-1 to 2-7 as shown in FIGS. 6A and6B. Under the adhering areas 2-1 to 2-7, connection holes 23-1 to 23-7for connecting vacuum pipes are provided respectively. After theformation of elements, the wafer side of a semiconductor wafer where thesegmented semiconductor chips 1 are bonded to adhesive tape 24 is causedto adhere to the wafer adhering section 2 and fixed in place. At thistime, arranging each semiconductor chip 1 in such a manner that the sideof the chip 1 crosses the peeling direction at right angles makes iteasy to recognize the position of each semiconductor chip 1 at the timeof pickup as shown in FIGS. 7A and 7B. As shown in FIGS. 7A and 7C,arranging each semiconductor chip 1 in such a manner that a diagonal ofeach chip 1 is parallel with the peeling direction (with an inclinationof 45 degrees if the semiconductor chip is a regular square) makes iteasy to peel the chip because the adhesive tape 24 starts to peel fromthe corner of the semiconductor chip 1. Whether to choose the former orlatter arrangement should be determined, taking into account the size orthickness of the semiconductor chip 1 and the adhesion of the adhesivetape 24.

The holding table 3 is designed to move each semiconductor chip 1 to thesuction unit 20 by moving a semiconductor wafer in the X and Ydirections. The video camera 4 is for monitoring the surface of thesemiconductor chip 1. The suction unit 20, which is provided under theholding table 3, has two vacuum pumps (or suction pumps) correspondingto the vacuum pipes (or suction pipes) of at least two systems providedso as to correspond to the adhering areas 2-1 to 2-7 of the waferadhering section 2, a changeover valve that switches between the vacuumpipes, and a control unit that controls the changeover valve.

The transfer mechanism that transfers the semiconductor chip 1 to aleadframe is composed of a bonding tool 8, a suction collet 10, aposition correction stage 11, and a bonding head 12. The suction collet10, which is also used in pickup, adheres by suction to thesemiconductor chip 1 peeled from the adhesive tape 24 and transfers itto the position correction stage 11. On the position correction stage11, the position of the semiconductor chip 1 is corrected. The bondinghead 8 transfers the position-corrected semiconductor chip 1 to theleadframe.

Furthermore, the conveyor mechanism that conveys the leadframe iscomposed of a leadframe supplying section 5, a leadframe conveying unit6, a paste supplying unit 7, and a leadframe housing section 9. Theleadframe supplying section 5, which houses leadframes before diebonding, feeds leadframes to the leadframe conveying unit 6sequentially. The paste supplying unit 7 applies conductive paste to thebed portion of the leadframe fed to the leadframe conveying unit 6. Inaddition, the leadframe housing section 9 houses the leadframessubjected to die bonding.

The whole operation of the die bonder configured as described above isroughly as follows. First, a wafer where elements have been formed issegmented into a plurality of semiconductor chips 1. These chips arestuck (or transferred) to adhesive tape 24. The resulting tape is put onthe holding table 3. Alternatively, cutting grooves are made alongdicing lines (or chip division lines) in the element formation surfaceside of the wafer where the formation of elements is completed. Afterthe adhesive tape 24 is bonded to the element formation surface, thewafer is segmented into a plurality of semiconductor chips 1 by grindingthe backside of the wafer until the cutting grooves have been at leastreached (dicing before grinding or BSG: Back Side Grinding). Thesesemiconductor chips 1 are put on the holding table 3.

Next, the suction unit 20 adheres directly to the semiconductor chips 1by suction and peels the adhesive tape by using the peeling claw 21 andauxiliary plate 22. Then, the holding table 3 is moved in the X and Ydirections. Using the video camera 4, the surface of the semiconductorchips 1 is monitored. The image data obtained from the monitoring isconverted into binary values or multiple values, thereby sensing thepositions of the semiconductor chips and the marks for determiningwhether the chips are good or bad. Then, while the suction unit 20 issucking the chips by vacuum (the unit 20 does not necessarily suck thechips depending on the size or thickness of the semiconductor chips),the suction head 10 sucks the semiconductor chip 1, picks up the chip,and transfers it to the position correction stage 11. After the suctionhead 10 corrects the position of the semiconductor chip 1 and, ifnecessary, reverses the chip, the bonding head 8 transfers the chip tothe leadframe.

After the end of the pickup, the holding table 3 is moved to theposition of a semiconductor chip 1 to be picked up next. Then, theabove-described operation is repeated.

On the other hand, the leadframe supplying section 5 feeds a leadframeto the leadframe conveying unit 6. The paste supplying unit 7 appliesconductive paste to the bed (or die pad) portion of the leadframeconveyed to the leadframe conveying unit 6. Then, the semiconductor chipconveyed by the bonding head 8 is mounted on the bed section of theleadframe. The leadframe subjected to die bonding is housed in theleadframe housing section 9. Such an operation is repeated.

Next, the adhesive tape peeling mechanism and the semiconductor chippickup mechanism in the die bonder and a peeling method and a pickupmethod which use the peeling mechanism and pickup mechanism will beexplained in further detail by reference to FIGS. 8, 9A, 9B, 10, 11, and12A to 12C.

A semiconductor wafer (or semiconductor chip 1) where adhesive tape 24has been bonded to the semiconductor element formation surface issegmented. Such a segmented wafer is prepared (STEP 1) and set on theholding table 3 (STEP 2). As shown in FIG. 8, the holding table 3 isprovided with vacuum pipes 25-1, 25-2 of two routes, pipe changeovervalves 26-1 to 26-7, and two vacuum pumps 27-1, 27-2. Using these, theadhesive tape 24 is peeled. First, using a first-route vacuum pipe 25-1and a first vacuum pump 27-1, the semiconductor wafer bonded to theadhesive tape 24 is sucked by vacuum and fixed in place (STEP 3). Inthis state, the peeling of the adhesive tape 24 is started. In peelingthe tape, one end of the adhesive tape 24 is held with the peeling claw21. The auxiliary plate 22 that aids peeling is set above the adhesivetape 24. The top surface of the adhesive tape 24 is held down with theauxiliary plate 22. In this state, while the adhesive tape 24 is beingbent, one end of the adhesive tape 24 is pulled with the peeling claw 21in the direction of the arrow shown in the figure at a speed of 0.1mm/sec to 50 mm/sec, more preferably, at a speed of 0.1 mm/sec to 10mm/sec (STEP 4). At this time, the peeling claw 21 may be pulled with avariable force. Alternatively, the tape may be peeled by moving the claw21 and auxiliary plate 22 at a constant speed. Still alternatively,after the tape is pulled with the claw 21 for a specific distance, thetop surface of the adhesive tape 24 may be held down with the auxiliaryplate 22 repeatedly. Then, when a part of the adhesive tape 24 near theadjacent adhering areas 2-1 to 2-7 of the wafer adhering section 2 ispeeled, the changeover valves 26-1 to 26-7 switch to a second-routevacuum pipe 25-2, which causes a second vacuum pump 27-2 to adhere bysuction to the peeled semiconductor chip 1 in the adhering area and fixthe remaining chips in place (STEP 5). FIG. 8 shows a state where thetape is peeled as far as the boundary area between the adhering area 2-1and adhering area 2-2 and the changeover valve 26-1 has been switched.

Similarly, the changeover valves 26-2 to 26-7 are switched sequentiallyas the adhesive tape is peeled. Then, in a state where the adhesive tape24 has been peeled completely, each semiconductor chip 1 is transferredfrom the adhesive tape 24 to the wafer adhering section 2. Then, thesecond vacuum pump 27-2 adheres to each semiconductor chip by suctionvia the second-route vacuum pipe 25-2 and fixes the chip in place (STEP6).

The auxiliary plate 22 may has a rounded tip as shown in FIG. 9A or asharp tip as shown in FIG. 9B. The shape of the tip portion isdetermined so as to peel the tape optimally according to the thickness,adhesion, or flexibility of the adhesive tape 24.

Next, after the position of the semiconductor chip 1 is sensed andwhether the chip is good or bad is determined (STEP 7), the picking upof each semiconductor chip 1 from the wafer adhering section 2 isstarted. Immediately after the pickup is started, the second vacuum pump27-2 causes the second-route vacuum pipe 25-2 to adhere to eachsemiconductor chip 1 by suction and fix it in place. In this state, useof the suction collet 10 causes the chip to be picked up only by suction(STEP 8). When the pickup proceeds close to the boundary of the adheringareas, the changeover valve is switched to the first-route vacuum pipe25-1, which causes the first vacuum pump 27-1 to suck in the picked-upadhering area (STEP 9-1). FIG. 10 shows a state where the pickup isalmost completed up to the adhering area 2-1 and the changeover valve26-1 corresponding to the adhering area 2-1 is closed.

As a result, the semiconductor chip 1 is picked up and a part of thewafer adhering section 2 is exposed, which not only prevents the suctionof the second vacuum pump 27-2 from decreasing but also adheres bysuction to the defective semiconductor chips remaining in the exposedwafer adhering section 2 and the elements on the periphery of the wafer,or non-product parts, and fixes them in place.

The changeover valve may be closed to stop the suction as shown in FIG.11, when the pickup proceeds and a semiconductor chip in the adheringarea is picked up (STEP 9-2). FIG. 11 shows a state where the pickupproceeds to the adhering area 2-4 and the changeover valves 26-1 to 26-3corresponding to the adhering areas 2-1 to 2-3 are closed.

Thereafter, as shown in FIGS. 12A to 12C, die bonding is done to aleadframe (STEP 10). FIG. 12A schematically shows the process of peelingthe adhesive tape 24. FIG. 12B schematically shows the pickup process.FIG. 12C schematically shows the process of mounting the semiconductorchip 1 onto a leadframe 13 with conductive paste 14.

Then, the defective products and the elements on the periphery of thewafer, or non-product parts, are discarded (STEP 11).

According to the above configuration and method, segmented semiconductorwafers can be caused to adhere by an optimal suction and be fixed inplace effectively according to the peeling position of adhesive tape orthe pickup state of a semiconductor chip. Consequently, cracks andchipping in the semiconductor chips can be prevented in peeling theadhesive tape or at the time of pickup. Such cracks and chipping becamea problem in making semiconductor chips thinner. Since pickup is carriedout only by adhesion, this prevents the thrust pin contact section fromcausing damage to the semiconductor chip. This damage was a problem inpicking up a chip with a conventional thrust pin.

In the prior art, when the thickness of a semiconductor chip was 50 μmor less, many cracks occurred when the semiconductor chip was picked up(100 pcs/100 pcs). Use of the embodiment of the present inventionreduced the occurrence of cracks to an almost negligible level (0/100pcs), even when the thickness of the semiconductor chip was 50 μm orless.

While in the first embodiment, explanation has been given taking a diebonder as an example, the present invention may, of course, be appliedto another semiconductor manufacturing apparatus that requires anadhesive tape peeling mechanism and a semiconductor chip pickupapparatus. For example, this invention may be applied to a picker that,after the adhesive tape 24 is peeled, picks up each semiconductor chip 1and packages it in a tray 15 as shown in FIGS. 14A, 14B, and 14C. Thepresent invention may be applied to a flip chip bonder that, after theadhesive tape 24 is peeled, picks up each semiconductor chip 1 andmounts the chip on a printed circuit board 16 by flip-chip connection asshown in FIGS. 15A, 15B, and 15C. The invention may be applied to a filmadhesion bonder that, after the adhesive tape 24 is peeled, picks upeach semiconductor chip 1 and mounts the chip on a thermoplastic filmsubstrate 17 as shown in FIGS. 16A to 16C. The invention may be appliedto an inner lead bonder that, after the adhesive tape 24 is peeled,picks up each semiconductor chip 1 and mounts the chip on TAB tape 18using heating tools 19 a, 19 b as shown in FIGS. 17A to 17C.

The adhesive tape 24 may comprise a base layer 24-1 and an adhesivelayer 24-2, which can be separated from each other. In this case, thesemiconductor chips 1 are picked up will be described with reference toFIGS. 55A and 55B.

First, only the base layer 24-1 is peeled from the adhesive layer 24-2as illustrated in FIG. 55A. The adhesive layer 24-2 remains adhered tothe semiconductor chips 1. Then, as shown in FIG. 55B, the suctioncollet 10 lifts a semiconductor chip 1, thus picking up the chip 1. Atthis time, that part of the adhesive layer 24-2 which holds the chip 1is torn from the remaining part of the adhesive layer 24-2. The adhesivelayer 24-2 has so high a strength that the part may no be torn from theother part as the collet 10 lifts the chip 1. If this is the case, thechip 1 may be picked up by one of the following three alternativemethods. The first method is to apply a laser beam to the adhesive layer24-1, cutting the layer 24-1 along the border between the chip 1 and theadjacent chip 1. The second method is to cut the layer 24-2 with a sharpcutter. The third method is to apply solvent to the layer 24-2, removinga narrow part of the layer 24-2 lying between the chips 1.

FIG. 18 helps explain an adhesive tape peeling mechanism, an adhesivetape peeling apparatus, an adhesive tape peeling method, a semiconductorchip pickup apparatus, a semiconductor chip pickup method, asemiconductor device manufacturing method, and a semiconductor devicemanufacturing apparatus which are related to a second embodiment of thepresent invention. FIG. 18 shows another configuration of the waferadhering section 2 used in the peeling mechanism. The peeling mechanismincludes a control unit 31 that switches between changeover valves 26-1to 26-7 according to the amount of peeling of the adhesive tape 24. InFIG. 18, the same component parts as those in FIG. 8 are indicated bythe same reference numerals and a detailed explanation of them will notbe given.

In the second embodiment, the amount of peeling of the adhesive tape 24is sensed according to the position (e.g., La to Lf) of the peeling claw21, the position of the auxiliary plate 22, changes in the suction ofthe vacuum pumps 27-1, 27-2, and the like. On the basis of the result ofthe sensing, as the peeling of the adhesive tape 24 moves over theadhering areas 2-1 to 2-7, the changeover valves 26-1 to 26-7 areswitched sequentially.

A sensing error of Δ1 in the positions La to Lf of the peeling claw 21(or auxiliary plate 22) is in the range of ±0.5 to 10 mm, morepreferably ±0.5 to 5 mm. The height Δ2 of the auxiliary plate 22 is inthe range of 0 to 10 mm from the surface of the adhesive tape 2, morepreferably 0 to 5 mm.

This configuration assures higher accuracy and prevents cracks andchipping from occurring when the adhesive tape 24 is peeled, even ifsemiconductor chips are thin.

Control of the changeover valves 26-1 to 26-7 by the control unit 31may, of course, be applied to picking up semiconductor chips.

FIGS. 19A and 19B, FIGS. 20A and 20B, FIGS. 21A and 21B, FIGS. 22A and22B, and FIGS. 23A and 23B show an adhesive tape peeling mechanism, anadhesive tape peeling apparatus, an adhesive tape peeling method, asemiconductor chip pickup apparatus, a semiconductor chip pickup method,and a semiconductor device manufacturing method, all according to thethird embodiment of the present invention. More precisely, these figuresillustrate a sequence of peeling an adhesive tape and a sequence ofpicking up a semiconductor chip. The third embodiment is advantageous inprocessing small semiconductor chips (e.g., chips having a size of 3×3mm or less), each having a film (e.g., surface protective film) that isvery firmly adhered to an adhesive tape, or for semiconductor chips,each having large concaves and convexes (like a chip having bumps on itssurface).

FIGS. 19A and 19B show a semiconductor wafer that has been just groundby dicing before grinding method. FIG. 19A is a perspective view of thewafer and FIG. 19B is a sectional view taken along line 19B-19B in FIG.19A. As seen from FIGS. 19A and 19B, an adhesive tape 24 is adhered to awafer ring 32. Semiconductor chips 1 are bonded to the adhesive tape 24.Both the wafer ring 32 and the adhesive tape 24 have been used in thestep of grinding the backside of the semiconductor wafer. It is desiredthat the adhesive tape 24, which is disc-shaped, be larger than thewafer, protruding from the circumference of the wafer. Thecircumferential part of the tape 24 should protrude from the wafer for adistance of, for example, 2 mm or more.

To peel the adhesive tape 24 from the semiconductor chips 1, a peelingtape 33 is adhered to the periphery of the adhesive tape 24 that isbonded to the wafer ring 32, as is illustrated in FIGS. 20A and 20B. Thepeeling apparatus pinches the peeling tape 33 with the peeling claw 21and pulls the tape 33 in a direction parallel to the surface of thewafer, thus gradually peeling the adhesive tape 24 from the wafer ring32. Alternatively, the peeling apparatus may pinches the edge of theadhesive tape 24 with the peeling claw 21 and pulls the tape 24 in adirection parallel to the surface of the wafer, thereby graduallypeeling the adhesive tape 24 from the wafer ring 32.

After peeled completely from the wafer ring 32, the adhesive tape 24will then be peeled from semiconductor chips 1, which are at thecircumferential part of the wafer held by the wafer holder (suctiontable). At this time, the tape 24 has already been peeled for a distanceΔL as shown in FIG. 23A. At the circumferential part of the wafer, thepeeled part of the adhesive tape 24 is inclined at an obtuse angle ΔX(90° or more) to the surface of each semiconductor chip 1.

This can minimize the force necessary for peeling the adhesive tape 24from the semiconductor chip (wafer) 1. If the chip 1 is small, the tape24 can be peeled from the chip 1 even if the tape 24 is firmly adheredto the surface protective film or if the chip 1 has large concaves andconvexes. Hence, the chip 1 would not remain on the adhesive tape 24.

The adhesive tape 24 is peeled further from the wafer as shown in FIGS.21A and 21B, in the same way as in the first and second embodiments. Asthe peeling of the tape 24 so proceeds, the changeover valves 26-2 to26-7 located in the partitioned suction areas of the wafer adheringsection 2 are actuated one after another. Thus, the semiconductor chips1, released from the tape 24, are secured to the wafer adhering section2 by virtue of vacuum suction.

Thereafter, the semiconductor chips 1 transferred from the adhesive tape24 to the wafer adhering section 2 are detected and picked up, one byone, each drawn to the suction collet 10, as illustrated in FIGS. 22Aand 22B.

The semiconductor chips 1 thus picked up are subjected to die bondingand tray packing.

The third embodiment can reliably peel an adhesive tape fromsemiconductor chips 1, if the chips 1 are small and the suction forcefor hold them is therefore small, if the film provided on each chip isfirmly bonded to the adhesive tape, or if the chips have large concavesand convexes in its surface. Hence, the third embodiment can pick up thesemiconductor chips without fail.

A wafer ring 32 is used in the third embodiment. Nonetheless, waferrings need not be used, as in the first embodiment and the secondembodiment. If no wafer ring is used, the adhesive tape 24 may have adiameter larger than that of the semiconductor wafer (for example, by 2mm). In this case, the tape 24 protrudes from the circumference of thewafer and is therefore easy to peel.

As indicated above, that part of the adhesive tape 24, which is beingpeeled from any semiconductor chip 1 provided at a circumferential partof the wafer, is inclined at an obtuse angle to the surface of thesemiconductor chip 1. This prevents the chip 1 from remaining on theadhesive tape 24.

FIG. 24 helps explain an adhesive tape peeling mechanism, an adhesivetape peeling apparatus, an adhesive tape peeling method, a semiconductorchip pickup apparatus, a semiconductor chip pickup method, asemiconductor device manufacturing method, and a semiconductor devicemanufacturing apparatus which are related to a second embodiment of thepresent invention. FIG. 24 schematically shows the configuration.

In the fourth embodiment, the mechanism of peeling the adhesive tape 24is housed in a chamber 27 (with the top surface of the holding tablebeing hermetically sealed) and pressure is applied to the adhesive tape24 to be peeled. In this case, the wafer adhering section 2 draws vacuumfrom the back. This makes larger the difference in pressure between theinside of the chamber 27 and the fixed section of the semiconductor chip1, thereby fixing the semiconductor chip 1 in place by a strong suction,which enables the adhesive tape 24 to be peeled from the semiconductorchip 1.

With this configuration, the suction of segmented semiconductor waferscan be increased, which makes it relatively easy to peel the adhesivetape even if the tape has a high adhesion.

Of course, not only the adhesive tape peeling mechanism but also thepickup apparatus may be housed in the chamber. Such an adhesive tapepeeling mechanism and pickup apparatus may be applied to anothersemiconductor device manufacturing apparatus.

FIGS. 25A, 25B to 43A, 43B show various examples of the configuration ofthe wafer adhering section applied to the first to fourth embodiments.FIGS. 25A and 25B show a case where a porous member of the waferadhering section is divided into two adhering areas in the direction inwhich the adhesive tape is peeled. FIGS. 26A and 26B show a case where aporous member of the wafer adhering section is divided into fiveadhering areas in the direction in which the adhesive tape is peeled.FIGS. 27A and 27B show a case where a porous member of the waferadhering section is divided into nine adhering areas in the direction inwhich the adhesive tape is peeled.

FIGS. 28A, 28B to 31A, 31B show a case where a porous member of thewafer adhering section is divided not only into a plurality of parts inthe direction in which the adhesive tape is peeled but also in two inthe direction perpendicular to the peeling direction, thereby forming 4,10, 14 and 18 adhering areas, respectively.

FIGS. 32A, 32B to 37A to 37B show a case where a plate 28 with a largenumber of through holes is provided on a porous member of the waferadhering section and a segmented semiconductor wafer 1 is caused toadhere by suction via the plate 28. In FIGS. 32A and 32B, the porousmember is divided into two adhering areas in the direction in whichadhesive tape is peeled. In FIGS. 33A and 33B, the porous member isdivided into five adhering areas. In FIGS. 34A and 34B, the porousmember is divided into seven adhering areas. In FIGS. 35A and 35B, theporous member is divided in two in the direction in which adhesive tapeis peeled and in two in the direction perpendicular to the peelingdirection, thereby forming four adhering areas. In FIGS. 36A and 36B,the porous member is divided into ten adhering areas. In FIGS. 37A and37B, the porous member is divided into 14 adhering areas.

FIGS. 38A, 38B to 43A to 43B show a case where a plate 30 with throughholes corresponding to the individual semiconductor chips is provided ona porous member of the wafer adhering section and each semiconductorchip is caused to adhere by suction via the plate 30. In FIGS. 38A and38B, the porous member is divided into two adhering areas in thedirection in which adhesive tape is peeled. In FIGS. 39A and 39B, theporous member is divided into five adhering areas. In FIGS. 40A and 40B,the porous member is divided into seven adhering areas. In FIGS. 41A and41B, the porous member is divided in two in the direction in whichadhesive tape is peeled and in two in the direction perpendicular to thepeeling direction, thereby forming four adhering areas. In FIGS. 42A and42B, the porous member is divided into ten adhering areas. In FIGS. 43Aand 43B, the porous member is divided into 14 adhering areas.

Each of the above-described configurations of the wafer adhering sectionis basically the same as that of the wafer adhering section shown inFIGS. 6A and 6B. From those configurations, the best one should beselected, taking into account the size and thickness of thesemiconductor chip 1 and the adhesion, thickness, and flexibility of theadhesive tape 24.

FIGS. 44A and 44B are sectional views to help explain anotherconfiguration of the wafer adhering section applied to the first tofourth embodiments. In FIGS. 44A and 44B, porous adhesive tape and asupport member for the porous adhesive tape are used to adhere to asegmented semiconductor wafer by suction. FIG. 44A is a sectional viewof the porous adhesive tape and FIG. 44B is a sectional view of thesupport member.

A porous adhesive tape 40 is used to transfer the semiconductor chips 1bonded to the adhesive tape 24. Adhesives 42-1, 42-2 are applied to bothsides of a porous member 41 of the porous adhesive tape 40 in such amanner that a large number of holes through which air passes from oneside to the other are not filled with the adhesives so as to assurebreathability. Any material, such as ceramic or resin, may be used asthe porous member 41, provided that it is porous. The adhesion of theadhesives 42-1 and 42-2 are set lower than that of an ordinary adhesivetape. The porous adhesive tape 40 has a round shape so as to fit theoutward form of a semiconductor wafer. On the side face of the porousadhesive tape 40, an air leak prevention tool 43 is provided to preventair from leaking. The air leak prevention tool 43 is formed by, forexample, adhesive resin or adhesive tape.

On the other hand, in a support member 45, through holes 44-1 to 44-7for vacuum suction which pass through from one side to the other aremade. These through holes 44-1 to 44-7 are provided so as to correspondto, for example, the changeover valves 26-1 to 26-7 for the vacuum pipes25-1, 25-2 of two routes in FIG. 8.

Then, as shown in FIG. 45, the reverse of the semiconductor chipadhering (transfer) side of the porous adhesive tape 40 is bonded to thesupport member 45.

Next, the process of peeling the adhesive tape 24 when the porousadhesive tape 40 shown in FIGS. 44A, 44B and 45 is used will beexplained by reference to FIGS. 46A to 46C.

Fixing jigs 46 with connection holes for connecting vacuum pipes areprovided on the bottom surface of the support member 45 so as tocorrespond to the vacuum suction through holes 44-1 to 44-7 in thesupport member 45. A vacuum is drawn by the vacuum pump 27-1 via thevacuum suction through holes in the support member 45, the connectionholes in the fixing jigs 46, and a large number of holes in the porousadhesive tape 40. This enables the vacuum suction by the vacuum pump27-1 and the adhesion of the adhesive 42-1 to fix the segmentedsemiconductor wafer (semiconductor chips) to the porous adhesive tape40. As a result, the vacuum suction compensates for the low adhesion ofthe porous adhesive tape 40.

With the semiconductor chip 1 caused to adhere by suction via thesupport member 45, the adhesive tape 24 bonded to the semiconductor chip1 is pulled in the direction of the arrow, thereby peeling the tape. Inpeeling the tape, one end of the adhesive tape 24 is held with thepeeling claw 21, and the auxiliary plate 22 to help peel is set abovethe adhesive tape 24. While the adhesive tape 24 is being bent, with thetop surface of the adhesive tape 24 being held down with the auxiliaryplate 22, one end of the adhesive tape 24 is pulled with the peelingclaw 21 in the direction of the arrow, thereby peeling the tape. At thistime, when a part of the adhesive tape 24 corresponding to the adjacentadhering through hole in the wafer adhering section is peeled, thechangeover valve switches to the second-route vacuum pipe 25-2, whichenables the suction of the vacuum pump 27-2 and the adhesion of theadhesive 42-1 to fix the peeled semiconductor chip in place. In theembodiment, the porous member 41 of the porous adhesive tape 40 is notpartitioned. Since resistance to the suction becomes greater as thedistance becomes larger, the porous member 41 applies suction mainly tothe semiconductor chip 1 close to the vacuum suction through hole, withthe result that the vicinity of the through hole becomes an adheringarea. A drop in the suction due to no partition can be compensated forby the adhesion of the adhesive 42-1. This produces the same effect aswhen the porous member is partitioned into a plurality of parts.

After the peeling of the adhesive tape 24 is completed, when the suctionby the vacuum pump 27-2 is stopped, the state shown in FIG. 46B results.In this state, each semiconductor chip 1 is fixed in place by theadhesion of the adhesive 42-1. When the fixing jig 46 is removed fromthe support member 45, the semiconductor chips 1 are transferred to theporous adhesive tape 40 bonded onto the support member 45 as shown inFIG. 46C.

The pickup process is carried out as shown in 47A. Of the semiconductorchips 1 transferred to the porous adhesive tape 40, the good productsare selected and caused to adhere by the vacuum suction of the suctioncollet 10 and be picked up in the direction of the arrow (upward). Inthis case, each semiconductor chip 1 is fixed only by the adhesion ofthe adhesive 42-1. In this state, the chip is picked up only by thesuction of the suction collet 10. This enables the defective chips 1′remaining in the exposed wafer adhering section and the elements on theperiphery of the wafer, non-product parts, to be fixed.

The semiconductor chip 1 may be fixed in place by both of the vacuumsuction and the adhesion of the porous adhesive tape 40 by drawingvacuum, if necessary, according to the size or thickness of thesemiconductor chip 1 or the adhesion of the porous adhesive tape 40.

FIG. 47B shows a state where the good semiconductor chips 1 have beenpicked up and the defective semiconductor chips 1′ have remained on theporous adhesive tape 40.

Thereafter, the support member 45 is removed from the porous adhesivetape 40 on which the defective semiconductor chips 1′ and the elementson the periphery of the wafer, non-product parts, remain as shown inFIG. 47C.

The support member 45 can be used repeatedly in the process of pickingup subsequent semiconductor chips. On the other hand, the porousadhesive tape 40 is discarded together with the defective semiconductorchips 1′ and the elements on the periphery of the wafer, non-productparts, bonded to the tape.

When a semiconductor chip 1 is picked up by the suction collet 10, thewafer adhering section with the aforementioned configuration enableseven a thinned semiconductor chip 1 to be peeled easily from the porousadhesive tape 40 because the porous adhesive tape has a low adhesion.This prevents damage to the semiconductor chip 1 caused at the time ofpickup and contributes to an improvement in the manufacturing yield.

While in the explanation, the adhesives 42-1, 42-2 are applied to bothsides of the porous adhesive tape 40, the adhesive 42-1 may be appliedonly to the semiconductor-chip-adhering surface of the porous adhesivetape 40. In this case, adhesive is applied in advance to the surface ofthe support member 45.

In the above example, the support member 45 is removed from the porousadhesive tape 40 and reused, whereas the porous adhesive tape 40 onwhich the defective semiconductor chips 1′ and the elements on theperiphery of the wafer, non-product parts, remain is discarded. However,as shown in FIG. 48A, adhesive tape 47 may be bonded to the surface ofthe defective chips 1′ (or the elements on the periphery of the wafer,non-product parts), the defective semiconductor chips 1′ may be peeledfrom the porous adhesive tape 40 as shown in FIG. 48B, and then theadhesive tape 47 and defective semiconductor chips 1′ may be discarded.In this case, the adhesion of the adhesive tape 47 has to be higher thanthat of the adhesive 42-1.

Thereafter, the support member 45 and porous adhesive tape 40 are usedagain in the next pickup process. In this way, the porous adhesive tape40 is reused, for example, twice to ten times, which helps reduce thecost.

Next, a concrete configuration of the support member 45 will beexplained using several examples. FIGS. 49A and 49B are a plan view anda sectional view of the support member, respectively. FIGS. 54A and 54Bare a plan view and a sectional view of the support member,respectively.

The support member 45 a shown in FIGS. 49A and 49B is a round flat platewhich is composed of metal, ceramic, resin, or the like and which has aplurality of through holes 48 made in it. These through holes 48 areprovided so as to correspond to the vacuum suction through holes (theconnection holes for connecting the vacuum pipes).

The support member 45 b shown in FIGS. 50A and 50B is a round flat plate49 which is composed of a porous member with many air-passing holes madeof ceramic, resin, or the like and has an air leak prevention tool 50 onits side face.

The support member 45 c shown in FIGS. 51A and 51B is a flat plate whichis made of metal, ceramic, resin, or the like and in the center of whicha through hole 51 is made.

No adhesive has been applied to the surface of any of the supportmembers 45 a, 45 b, and 45 c shown in FIGS. 49A and 49B to FIGS. 51A and51B. Therefore, when such support members 45 a, 45 b, and 45 c are used,the adhesive 42-2 has to be applied in advance to the surface of theporous adhesive tape 40 adhering to the support members 45 a, 45 b. 45c.

In contrast, the support members 45 d, 45 e, 45 f shown in FIGS. 52A and52B to FIGS. 54A and 54B have adhesives 51, 52, 53 applied to one sideof each of them. The adhesives 52, 53, 54 are applied so as not to fillup the vacuum suction holes. That is, in the support member 45 d shownin FIGS. 52A and 52B, the adhesive 52 is applied to the surface where aplurality of through holes 48 are not present. In the support member 45e shown in FIGS. 53A and 53B, the adhesive 53 is applied to the surfaceof the support member in such a manner that the adhesive 53 does notfill up a large number of holes made in the porous member 49 on whoseside face the air leak prevention tool 50 is provided. In the supportmember 45 f shown in FIGS. 54A and 54B, the adhesive 54 is applied tothe surface of the area where the single hole 51 is not present.

The support members 45 d, 45 e, 45 f shown in FIGS. 52A and 52B to FIGS.54A and 54B may be applied to both cases where adhesive is applied tothe surface of the porous adhesive tape 40 adhering to the supportmember and where no adhesive is applied to the surface of the porousadhesive tape 40 adhering to the support member.

When any one of the support members 45 a to 45 f is used, use of vacuumsuction holes enables the semiconductor chips to adhere to the porousadhesive tape by vacuum suction by drawing air from the side of thesupport member 45 a to 45 f with the porous adhesive tape 40 beingbonded to the support members 45 a to 45 f.

With the above-described configuration of the wafer adhering sectionusing the porous adhesive tape 40, use of both vacuum suction and theadhesion of adhesive enables the adhesive of the porous adhesive tape 40to be made lower than that of ordinary adhesive tape. Therefore, whenthe adhesive tape 24 is peeled, vacuum suction and the adhesion ofadhesive cause the segmented semiconductor wafer to adhere strongly bysuction. When the semiconductor chip 1 is picked up from the porousadhesive tape 40, it can be peeled easily by stopping or weakening thevacuum suction. This prevents damage to the semiconductor chip 1 andtherefore improves the manufacturing yield.

As has been described above, according to an aspect of the presentinvention, there are provided an adhesive tape peeling mechanism, anadhesive tape peeling apparatus, an adhesive tape peeling method, asemiconductor chip pickup apparatus, a semiconductor chip pickup method,a semiconductor device manufacturing method, and a semiconductor devicemanufacturing apparatus which are capable of not only manufacturinghigh-quality semiconductor devices by decreasing such defects as cracksin chips or chipping but also suppressing a decrease in themanufacturing yield.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. An adhesive tape peeling mechanism, comprising: an adhering sectionwhich adheres by suction to a segmented semiconductor wafer bonded to anadhesive tape; a porous member which is provided on the surface adheringto said segmented semiconductor wafer of said adhering section and isdivided into at least two adhering areas in the direction in whichadhesive tape is peeled and which adheres to said segmentedsemiconductor wafer by suction and fixes said segmented semiconductorwafer in place; and a chamber which applies pressure to adhesive tape tobe peeled.
 2. The mechanism according to claim 1, further comprisingvacuum pipes of at least two routes which are provided so as tocorrespond to said adhering areas and are for adhering to said segmentedsemiconductor wafer by suction and which are switched according to thepeeling position of said adhesive tape to adhere to said segmentedsemiconductor wafer by suction.
 3. The mechanism according to claim 2,wherein said vacuum pipes are switched when the peeling of said adhesivetape almost reaches said adjacent adhering areas.
 4. A semiconductordevice manufacturing apparatus comprising the adhesive tape peelingmechanism of claim
 1. 5. An apparatus for peeling adhesive tape bondedto a segmented semiconductor wafer, comprising: a holding table whichincludes a wafer adhering section having a porous member divided into atleast two adhering areas in the direction in which adhesive tape ispeeled and which adheres by suction to said segmented semiconductorwafer bonded to adhesive tape and fixes said segmented semiconductorwafer in place; a peeling claw which pulls one end of said adhesive tapeand peels the tape; a chamber which applies pressure to the holdingtable that holds said segmented semiconductor wafer and said peelingclaw; a first suction device which adheres to said segmentedsemiconductor wafer by suction through a first suction path provided soas to correspond to each adhering area of said wafer adhering section,the first suction device having a first suction force by which saidsegmented semiconductor wafer is fixable even when said peeling clawpulls one end of said adhesive tape to peel said adhesive tape; a secondsuction device which adheres to said segmented semiconductor wafer bysuction through a second suction path provided so as to correspond toeach adhering area of said wafer adhering section, the second suctiondevice having a second suction force by which said segmentedsemiconductor wafer is fixable after said adhesive tape is peeled;changeover valves provided corresponding to the respective adheringareas of the wafer adhering section, and arranged to each performswitching, for a corresponding one of the adhering areas, betweensuction through a corresponding one of the first suction paths andsuction through a corresponding one of the second suction paths; and acontrol unit which controls the changeover valves, wherein one end ofthe adhesive tape is pulled and peeled with said peeling claw, while thefirst suction device is adhering to said segmented semiconductor waferby suction through the first suction path, when the one end of theadhesive tape on one of the adhering areas of the wafer adhering sectionis peeled earlier than another part of said adhesive tape on an adjacentone of the adhering areas, the control unit controls a corresponding oneof the changeover valves to switch the first suction path to the secondsuction path in the one of the adhering areas in which the peeling ofthe one end of the adhesive tape is completed; and the second suctionpath corresponding to the one of the adhering areas from which the oneend of the adhesive tape is peeled suctions and holds the segmentedsemiconductor wafer by the second suction device.
 6. The apparatusaccording to claim 5, further comprising an auxiliary plate which isplaced above said adhesive tape in the direction perpendicular to saidpeeling direction and which is for moving said peeling claw in the samedirection as that of the surface of said adhesive tape by supportingsaid adhesive tape.
 7. The apparatus according to claim 5, wherein theadhering surface of said segmented semiconductor wafer on said waferadhering section has a large number of through holes.
 8. The apparatusaccording to claim 5, wherein each of the adhering areas of said waferadhering section corresponds to said segmented semiconductor wafer. 9.The apparatus according to claim 5, further comprising a plate whichintervenes between the adhering surface of said wafer adhering sectionand said segmented semiconductor wafer and has suction holescorresponding to said segmented semiconductor wafer.
 10. A semiconductordevice manufacturing apparatus comprising the apparatus for peelingadhesive tape of claim
 5. 11. The apparatus according to claim 5,wherein the second suction force is weaker than the first suction force.12. A pickup apparatus which has a peeling mechanism for peelingadhesive tape bonded to a segmented semiconductor wafer and picks upsemiconductor chips, said pickup apparatus comprising: a holding tablewhich includes a wafer adhering section having a porous member dividedinto at least two adhering areas in the direction in which adhesive tapeis peeled and which adheres by suction to said segmented semiconductorwafer bonded to adhesive tape and fixes said segmented semiconductorwafer in place; a peeling claw which pulls one end of said adhesive tapeand peels said adhesive tape; a chamber which applies pressure not onlyto the holding table that adheres to said segmented semiconductor waferby suction and fixes the wafer in place but also to said peeling claw; afirst suction device which adheres to said segmented semiconductor waferby suction through a first suction path provided so as to correspond toeach adhering area of said wafer adhering section, the first suctiondevice having a first suction force by which said segmentedsemiconductor wafer is fixable even when said peeling claw pulls one endof said adhesive tape to peel said adhesive tape; a second suctiondevice which adheres to said segmented semiconductor wafer by suctionthrough a second suction path provided so as to correspond to eachadhering area of said wafer adhering section, the second suction devicehaving a second suction force by which said segmented semiconductorwafer is fixable when each semiconductor chip is picked up; changeovervalves provided corresponding to the respective adhering areas of thewafer adhering section, and arranged to each perform switching, for acorresponding one of the adhering areas, between suction through acorresponding one of the first suction paths and suction through acorresponding one of the second suction paths; a control unit whichcontrols the changeover valves; and a suction collet which adheres toeach semiconductor chip by suction and picks up said semiconductor chip,wherein one end of the adhesive tape is pulled and peeled with saidpeeling claw, while the first suction device is adhering to saidsegmented semiconductor wafer by suction through the first suction path,when the one end of the adhesive tape on one of the adhering areas ofthe wafer adhering section is peeled earlier than another part of saidadhesive tape on an adjacent one of the adhering areas, the control unitcontrols a corresponding one of the changeover valves to switch thefirst suction path to the second suction path in the one of the adheringareas in which the peeling of the one end of the adhesive tape iscompleted; and the second suction path corresponding to the one of theadhering areas from which the one end of the adhesive tape is peeledsuctions and holds the segmented semiconductor wafer by the secondsuction device; said suction collet adheres to each semiconductor chipby suction and picks up said semiconductor chip after the peeling ofsaid adhesive tape is completed; and the control unit controls one ofthe changeover valves which corresponds to an adhering area from whichthe semiconductor chip is picked up, and closes the one of thechangeover valves to stop suction.
 13. The apparatus according to claim12, wherein, when said suction collet adheres to each of saidsemiconductor chips by suction and picks up one of said semiconductorchips, at the time when the pickup of said one of said semiconductorchips in each adhering area is completed, the suction by said secondsuction devices is completed.
 14. The apparatus according to claim 12,further comprising an auxiliary plate which is placed above saidadhesive tape in the direction perpendicular to the peeling directionand which is for moving said peeling claw in the same direction as thatof the surface of said adhesive tape by supporting said adhesive tape.15. The apparatus according to claim 12, wherein the surface adhering tosaid segmented semiconductor wafer of said porous member of said waferadhering section has a large number of through holes.
 16. The apparatusaccording to claim 12, wherein each of the at least two adhering areasof said porous member of said wafer adhering section corresponds to saidsegmented semiconductor wafer.
 17. The apparatus according to claim 12,further comprising a plate which intervenes between the adhering surfaceof said wafer adhering section and said segmented semiconductor waferand has suction holes corresponding to said segmented semiconductorwafer.
 18. A semiconductor device manufacturing apparatus comprisingpickup apparatus according to claim
 12. 19. The apparatus to claim 12,wherein the second suction force is weaker than the first suction force.